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The problems of thick tin layer formation by ion sputtering…
Engineering Journal: Science and Innovation # 1·2018 11
The problems of thick tin layer formation
by ion sputtering in magnetron systems in target vapors
© M.V. Makarova, K.M. Moiseev
Bauman Moscow State Technical University, Moscow, 105005, Russia
The article describes the process of thick-film tin coating deposition by the ion sputtering
in magnetron systems in target vapors realized and studied for the first time. The physics
of this deposition method for films of various materials is described and the stages and
features of the technological process of deposition of tin coatings are analyzed. The
analysis of the arising technological problems such as increased thermal effect on the
substrate during the deposition process, unstable process transition into the self-
sputtering regime after melting the target, and reduced deposition rate when working
with molten tin, not having gone to the self-sputtering regime is performed. The ways of
solving the listed problems are proposed, as a result of which the stable process of applying
tin coatings with high deposition rates of about 9 μm / min has been worked out. The quality
of the samples of the tin coating deposited on ceramic substrates made of aluminum nitride
obtained during variations of the deposition process is evaluated.
Keywords:
liquid-phase magnetron, tin, thick-film coating, vacuum deposition, ion sput-
tering, target vapors
REFERENCES
[1]
Alekseev S.N.
Electrovacuumnye pribory
[Electronic tubes]. Ulyanovsk, UlSTU
Publ., 2003.
[2]
Dukholpelnikov D.V.
Magnetronnye raspylitelnye sistemy s electromagnitami
.
Diss. cand. tekhn. nauk. Avtoreferat
[Magnetron sputtering systems with
electromagnets. Cand. eng. sc. diss. Author's abstract]. Moscow, 2007.
[3]
Razumneva N.
Pryamaya pechat ptovodyashchikh materialov
[Direct printing
conducting materials]. Available at:
https://www.dipaul.ru/pressroom/pryamaya-pechat-provodyashchikh-materialov/ (accessed August 25, 2017).
[4]
Gamburg Yu.D.
Galvanicheskie pokrytiya
[Galvanic coatings. Reference book
on application]. Moscow, Technosfera Publ., 2006.
[5]
Makarova M.V., Moiseev K.M. Issledovanie svoystv mednykh plenok,
poluchennykh metodom ionnogo raspyleniya v magnetronnykh sistemakh v
parakh misheni [Investigation of the properties of copper films obtained by ion
sputtering in magnetron systems in target vapors]. In:
Vakuumnaya tekhnika,
materialy i tekhnologii.
Sb. trudov 12-y Mezhdunarodnoy nauchno-tekhnichskoy
konferentsii
[Vacuum technology, materials and technologies. Proceedings of
the 12
th
International Scientific-Technological Conference]. Moscow, 2017,
pp. 124–128.
[6]
Makarova M.V., Vasilyev D.D., Moiseev K.M. Protsess ionnogo raspyleniya v
magnetronnykh sistemakh v parakh misheni [The process of ion sputtering in
magnetron systems in target vapors]. In:
Budushchee mashinostroeniya v Rossii.
Sb. trudov 9 Vserossiyskoy konferentsii molodykh uchenykh i spetsialistov
[The
future of mechanical engineering in Russia. Proceedings of the 9th All-Russia
Conference of Young Scientists and Specialists]. Moscow, BMSTU Publ., 2016,
pp. 298–305.