Эффективный метод производства flip–chip-компонентов
7
Effective method of flip-chip components production
©
S.A. Adarchin
1
, V.G. Kosushkin
1
, E.N. Adarchina
2
1
Kaluga Branch of Bauman Moscow State Technical University, Kaluga 248000, Russia
2
JSC "Kaluga Research Institute of Telemechanical devices", Kaluga 24800, Russia
The work is devoted to developing and testing a new method of forming a ball lead of
integrated chips at their assembly, embodiment and installation on printed-circuit
boards. The study makes an analysis of a priori known methods of assembling semicon-
ductor devices and reveals their main shortcomings.
The technique of forming ball leads, which makes it possible to considerably raise the
integrated chip assembly efficiency, is offered. The proposed method can be used both in
production of frame integrated chips, and at open-frame installation of semiconductor
electronic devices on printed-circuit boards, hybrid integrated chips and RFID. We se-
lected materials for forming the ball leads and defined modes for forming contacts. The
special attention is paid to establishment of technological parameters in the large-scale
production equipment, which is an essential groundwork for practical application of the
offered method.
Keywords:
FLIP-CHIP, integrated chip, soldering, temperature features, surface mount
technology
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Adarchin S.A.
(b. 1976) graduated from
Kaluga Branch of Bauman Moscow State
Technical University in 2000. Ph.D., Assoc. Professor, Deputy Head of the Materials
Sciences Department at Kaluga Branch of Bauman Moscow State Technical University.
Research interests: electronics, reliability, physics of semiconductors.
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