Engineering Journal: Science and InnovationELECTRONIC SCIENCE AND ENGINEERING PUBLICATION
Certificate of Registration Media number Эл #ФС77-53688 of 17 April 2013. ISSN 2308-6033. DOI 10.18698/2308-6033
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Effective method of flip-chip components production

Published: 11.10.2014

Authors: Adarchin S.A., Kosushkin V.G., Adarchina E.N.

Published in issue: #3(27)/2014

DOI: 10.18698/2308-6033-2014-3-1291

Category: Instrumentation

    FLIP-CHIP, integrated chip, soldering, temperature features, surface mount technology
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